http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009191122-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2008-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d622f9c37d2747884805296445278343 |
| publicationDate | 2009-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2009191122-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To provide a coupling agent-impregnated porous inorganic material obtained by impregnating a porous inorganic fine particle used as an inorganic filler of an epoxy resin composition with a coupling agent, an epoxy resin composition containing the same, and a semiconductor An object is to provide an apparatus. An epoxy resin composition comprising (A) an epoxy resin, (B) a phenol resin curing agent, (C) an inorganic filler, (D) a curing accelerator, and (E) a silane coupling agent. ) It is characterized by using a silane coupling agent impregnated with porous inorganic fine particles having an average particle size of 4.0 to 10.0 μm, a specific surface area of 280 to 700 m 2 / g, and an oil absorption of 70 to 350 ml / 100 g. An epoxy resin composition. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014065032-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180027336-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018039981-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014010559-A1 |
| priorityDate | 2008-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 75.