| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32495
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32559 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05H1-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B01J19-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B01J19-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F4-00 |
| filingDate |
1995-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7363c463cb5da4c268f86ac5ec64a027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2cab6bdbad4872b5228e35192ef33f37
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_215039442bc2715fc3b06fbc0b596b99
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c32f45c8b33375c8a62292f75cd29866
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dfebecf088fec583758141ec73d0e86a |
| publicationDate |
1996-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H0871408-A |
| titleOfInvention |
Ceramic protection for heated metal surface of plasma processing chamber exposed to chemically attacked gas environment and method for protecting the heated metal surface |
| abstract |
(57) [Summary] (Modified) [Purpose] A compatible metal such as aluminum can be used as an electrode material for plasma processing equipment, while resisting attack by aggressive species generated in plasma. The resulting surface is provided without the prior art inconsistencies between the aluminum electrode and the protective ceramic surface. A non-bonded ceramic protection is used to prevent or prevent attack of a heated metal surface by chemically attacking chemical species generated in the plasma during processing of the material, such as metal surfaces within the plasma processing chamber, especially within the plasma processing chamber. The heating metal electrode is provided without bonding the ceramic material to the metal surface. The ceramic protective material comprises a thin cover material that is attached intimately but unbonded to the heated metal. This ceramic protection feature is effective in protecting the surface of the glow discharge electrode and the gas disperser in the plasma processing chamber used to process the semiconductor substrate forming the integrated circuit structure. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006157043-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006045059-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002520835-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0878193-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012222157-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0925586-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016154159-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011062900-A3 |
| priorityDate |
1994-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |