patent/JP-H0845972-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0845972-A

Outgoing Links

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filingDate	1994-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0cc578f57f912c8788c7c19a47518ef8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b552e26d32fa951519881d359be5552 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c9c4b8bfe3e9e61a66d42a4e418c1825
publicationDate	1996-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	JP-H0845972-A
titleOfInvention	Method for manufacturing semiconductor device
abstract	(57) [Abstract] [Purpose] Inside a large number of cavities formed in the circuit board, Efficiently fill the sealing resin. [Structure] A multi-cavity circuit board 10 in which a large number of cavities 12 are formed, a sealing resin sheet 20 made of crosslinked polyolefin, and a surface molding release sheet 3 1 and the weight plate 32 are sequentially stacked, and the vacuum heating furnace 33 Place inside and heat in vacuum. Sealing resin sheet 20 When heated, the resin melts and becomes in a state of being filled in each cavity 12. Further, by heating the multiple cavity circuit board 10, the molten resin filled in each cavity 12 is cured.
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priorityDate	1994-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Incoming Links

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Total number of triples: 112.