| abstract |
Provided is a method for producing, via a simple technique, an electronic component wherein the tight adhesion between a fluorine resin and an electronic element is excellent. Also provided is an electronic component. The electronic component production method comprises a step of disposing a resin composition on an electronic element mounted on a wiring base material and a step of heating the resin composition at the melting point thereof or higher, thereby covering the electronic element with the resin composition, the electronic component production method being characterized in that the resin composition contains a crystalline fluorine resin, and contains substantially no volatile components. |