| abstract |
SUMMARY OF THE INVENTION An object of the present invention is to provide a method for producing an electronic component, in which voids in the resin encapsulating portion and deterioration of characteristics with time are unlikely to occur, and which can be reduced in cost.n n n According to the structure of this invention, each SAW element 2 and resin film 12 mounted on the mounting assembly board | substrate 11 are put in the bag 13 provided with gas-barrier property, A reduced-pressure packaging step is formed to seal. The SAW element 2 is made into a resin film by infiltrating the resin film 12 based on the pressure difference inside and outside the bag 13 between each SAW element 2 mounted on the pressure-sensitive package mounting substrate 11. (12) The sealing process sealed by the sealing resin part 4 derived from is formed.n n n n Mounting board, SAW element, encapsulation resin part, mounting integrated board |