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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-34
filingDate 1994-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1a49dac842171e5ad359719ca034a42e
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publicationDate 1995-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0790573-A
titleOfInvention Sputtering method and apparatus and thin film manufacturing method
abstract (57) [Summary] [Construction] In a sputtering method in which a negative voltage is applied intermittently at a constant cycle, the voltage is controlled to 0 V for at least a part of the time when the negative voltage is not applied. A sputtering method, which has a time of 24 and is equal to or longer than the time required from the occurrence of one arc discharge to its disappearance. [Effect] The occurrence of arcing can be prevented, and the discharge can be stably maintained for a longer period of time than in ordinary DC sputtering.
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