Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e722311c5a30f83cf91146b47bd21f0b |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J27-1853 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07C57-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07C51-377 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F4-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07C51-377 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B01J27-185 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07C57-03 |
filingDate |
1992-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6492e02deca942e838e681035e236195 |
publicationDate |
1995-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-H07321090-A |
titleOfInvention |
Post-etching method |
abstract |
(57) [Summary] [Objective] The polymer adhering to the surface of the material is removed by an etching treatment to shorten the processing time of the next step and improve the reproducibility of etching. A low-pressure atmosphere is set in a processing container into which a semiconductor wafer W having a SiO2 film 31 and a photoresist layer 32 is formed, an etching gas mixed with CF4 + CHF3 + Ar is supplied, and plasma is applied to the SiO2 of the semiconductor wafer W. The film 31 and the photoresist layer 32 are etched. After the etching process, a post-process is performed using a process gas mixed with CF4 + Ar. As a result, the polymer 34 formed on the surface of the semiconductor wafer W by the etching process can be removed. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015170763-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0825642-A2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0825642-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140124334-A |
priorityDate |
1969-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |