| abstract |
(57) [Summary] [Structure] (a) A biphenyl type epoxy resin represented by the following general formula (1) and (b) an epoxy resin represented by the following general formula (2) in a weight ratio of (a) / (B) = 6/4 An epoxy resin composition comprising an epoxy resin, a phenol resin as a curing agent, an inorganic filler, and a curing accelerator, which are contained at a ratio of ˜9.5 / 0.5, as essential components. [Chemical 1] [Chemical 2] (Wherein R 1 and R 2 are hydrogen atoms, halogen atoms or alkyl groups having 1 to 5 carbon atoms, k is an integer of 0 to 3, and m is 0 to 3 is an integer, p is 1 or 2, and q is an integer of 0 to 5. [Effect] The epoxy resin composition of the present invention provides a cured product having good fluidity, less void formation during molding, low hygroscopicity, and good solder heat resistance. In addition, the semiconductor device of the present invention has high reliability against thermal shock during surface mounting by being sealed with the cured product of the epoxy resin composition. |