| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-003 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-296
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2019-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7c1e0d50fcf446089bf6d63d3ed4588
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_815dd96aa12ccdc93519d587b3a77d31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_289e8748cb5c9417b1cc93c3818a4f46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_36671b6e24eb9f5c8740fced7685ecd9 |
| publicationDate |
2020-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20200018288-A |
| titleOfInvention |
Heat-curable resin composition for semiconductor encapsulation and semiconductor device |
| abstract |
[Problem] Providing a cured product excellent in tracking resistance and dielectric properties, and providing a thermosetting resin composition for semiconductor encapsulation having good continuous moldability and a semiconductor device sealed with a cured product of the resin composition. [Workaround] The thermosetting resin composition for semiconductor sealing containing the following components (A)-(E). (A) Epoxy resin which is solid at 25 degreeC other than silicone modified epoxy resin (B) silicone modified epoxy resin (C) A cyclic imide compound containing at least one dimer acid skeleton, at least one straight chain alkylene group having at least one C6 or more, at least one alkyl group having at least 6 carbon atoms, and at least two cyclic imide groups (D) inorganic filler (E) anionic curing accelerator |
| priorityDate |
2018-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |