| abstract |
[PROBLEMS] To provide a resin composition and a semiconductor device sealed with the cured product which are excellent in moldability, have a low modulus at high temperatures, have no decrease in glass transition temperature, and which have good reflow property and heat resistance. [Workaround] The thermosetting resin composition for semiconductor sealing containing the following component (A), (B), (C) and (D). (A) Epoxy resin that is solid at 25 ° C (B) organopolysiloxane having at least one cyclic imide group and at least one siloxane bond in one molecule (C) inorganic filler (D) anionic curing accelerator |