http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0714835-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d6402b23ab8782152be47b3996e48a4a
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
filingDate 1993-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cc65e17ebf6cbe92d268f53f4f08c0a3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_66ba5f44bd70d834e1985b3c722f132b
publicationDate 1995-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0714835-A
titleOfInvention Method for forming multilayer wiring structure
abstract (57) [Abstract] [Purpose] It is intended to improve the wiring density without affecting the underlying substrate or the like even when the misalignment of the through hole occurs. [Structure] First, a lower layer Al wiring 5 is patterned on a boron phosphorus glass 4 formed on a substrate 1. next, On top of this, this lower layer Al wiring 4 and boron phosphorus glass 4 A silicon nitride film 6 that is corroded by an etchant different from that is formed. Next, a plasma oxide film 7 film which is corroded by an etchant different from the silicon nitride film 6 is formed on the silicon nitride film 6. Next, after forming the resist film 8, a through hole pattern 9 is formed using CHF 3 gas. Next, through-hole pattern 9 The silicon nitride film 6 exposed at the bottom of the is removed by using a CF 4 +0 2 based gas. Thereafter, the upper wiring layer 10 is deposited on this upper layer portion.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0825642-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0825642-A2
priorityDate 1993-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID3084099
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419522015

Total number of triples: 20.