| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6cfc033f059d282fcd915bc8be2ae53f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19105 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
1993-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1c65c88d6608870b7ea8e691cd63a23f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d0a70b1b66c1dda7e76043cdca88d49a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ee99facb4e2e39d735e778936622874f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a78ef0ac4bd260efef1780343f528063
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5f60a14f21a8c23650c81eb8a9cf8f88
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b85e96f499adf312931add3f5d059d78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_10c46325fb4d6a3b2bbe4420736aee89
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f9b55160ddbee30228a0f41dd62d9295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5e59ffefdf623beaeaeae11c4790e3f2 |
| publicationDate |
1994-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H0653621-A |
| titleOfInvention |
Stereoscopic printed board, electronic circuit package using the same, and method of manufacturing printed board |
| abstract |
(57) [Summary] [Objective] To provide a three-dimensional printed circuit board that enables high-density mounting and has excellent heat dissipation and electromagnetic shielding properties. [Structure] Thermoplastic polyimide is used as the insulating layers 102 and 104, and a metal plate 101 and a wiring conductor (copper foil) 103, 105 is laminated via insulating layers 102 and 104 to form a metal base substrate having a multilayer structure. This metal base substrate is bent and deep-drawn to form a box having an opening surface 180. A brim 107 having a lead used for connection with another wiring board is provided on the periphery of the opening surface 180. The edge portion 107A of the brim portion and the tip end 110A of the lead portion are formed so as to be separated from each other. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020517115-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11251754-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11284092-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018107394-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190123313-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11557709-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7746666-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H09199853-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5672414-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10340973-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10117069-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H08264911-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100306447-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210055806-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7495183-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017028177-A |
| priorityDate |
1992-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |