http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10117069-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c62268de3e92657ca5b9adcac4778225 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-056 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4664 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4069 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 |
| filingDate | 1996-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c4ed00b05c704a45be6b72dbedc71f8a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0f1b19d7c9856425eb78ec0c3efb5a81 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1716b503bfe8f3759b6fd31ce7698193 |
| publicationDate | 1998-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H10117069-A |
| titleOfInvention | Metal-based multilayer circuit board |
| abstract | [PROBLEMS] To provide a metal-based multilayer circuit board capable of flowing a large current of about 1 A / hole or more to a via-hole conductor. SOLUTION: (1) A circuit conductor layer is joined via a second insulating adhesive layer to a metal base circuit board formed by forming a conductor circuit on a metal plate via a first insulating adhesive layer. Process (2) a step of forming a through hole for electrically connecting the conductor circuit and the circuit conductor layer; (3) a metal-based multilayer circuit board obtained through a step of forming a circuit in the circuit conductor layer. A diameter of the via hole is 0.5 mm or more, and the via hole is filled with a conductive material. Said metal-based multi-layer circuit board which is an attachable material, more preferably a copper paste. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6848178-B2 |
| priorityDate | 1996-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.