| abstract |
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal base semiconductor circuit board and a method of manufacturing the same, wherein the flatness of the external terminal and the junction is good, and the infrared ray in the solder reflow is good in the mountability to the mother substrate, which has a small change in shape at a temperature change. It is an object of the present invention to provide a metal base semiconductor circuit board having improved properties such as plating resistivity and high connection reliability, and a method of manufacturing the same. A polyimide layer having specific properties is laminated on the base metal of the metal base semiconductor circuit board. Here, (a) the layer of the thermoplastic polyimide (1) and the layer of the non-thermoplastic polyimide are sequentially laminated on the base metal. (b) The layer of the thermoplastic polyimide (1), the layer of the non-thermoplastic polyimide, and the layer of the thermoplastic polyimide (2) are sequentially laminated on the base metal. (c) A layer of non-thermoplastic polyimide is laminated on the base metal. (d) Four lamination methods of laminating the thermoplastic polyimide layer 2 on the base metal are used. |