| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ad2afaa30d5877bd844cc746db821920 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-04 |
| filingDate |
2019-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d516f6e6024f8fb025701924e29b2b9f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d870e39b0c2681ce7c3e7e6d5fd0442
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb9db0ad8f275d495288674b5ae1b70f |
| publicationDate |
2020-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2020152778-A |
| titleOfInvention |
Conductive composition |
| abstract |
PROBLEM TO BE SOLVED: To provide a conductive composition capable of forming a cured product having good wettability of solder. SOLUTION: The conductive composition of the present invention contains a binder component containing a thermosetting compound, metal particles, and a fluorine-based surfactant, and the metal particles include low melting point metal particles having a melting point of 240 ° C. or lower. It contains high melting point metal particles having a melting point of 800 ° C. or higher, and the content of the metal particles is 1000 to 2000 parts by mass and the content of the low melting point metal particles is 10 to 900 parts by mass with respect to 100 parts by mass of the binder component. is there. [Selection diagram] Fig. 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7249473-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023282351-A1 |
| priorityDate |
2019-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |