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filingDate 2016-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2017-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2017152221-A
titleOfInvention Heat curable conductive paste composition and cured product thereof
abstract PROBLEM TO BE SOLVED: To provide a thermosetting conductive paste composition which can form a circuit having a good resistance value even when heated at 100 ° C. or less, and has good storage stability and stability at room temperature. SOLUTION: (A) The silver powder component is a mixed silver powder in which (A-1) flaky silver powder and (A-2) granular silver powder are mixed to limit the tap density. The (B) epoxy resin component is a blended epoxy resin in which a weight average molecular weight and an epoxy equivalent are within a predetermined range and (B-1) a solid epoxy resin and (B-2) a liquid epoxy resin are blended at a predetermined ratio. (C) The epoxy resin curing agent is a urea bond-containing modified aliphatic polyamine system having an exothermic peak of differential thermal analysis under a predetermined condition of less than 120 ° C. In each of these components, the first condition: the content of the component (A) in the components (A) and (B) is 90% by weight or more, and the second condition: (C) in the components (B) and (C) ) The component is blended so as to satisfy the content of 5 to 20% by weight. [Selection figure] None
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