| abstract |
Provided are: a conductive paste which has a long pot life and a viscosity suitable for filling holes of a substrate, and which provides a cured product having excellent electrical conductivity and excellent long-term reliability; and a multilayer substrate which uses this conductive paste.nThe present invention uses a conductive paste which contains, relative to 100 parts by mass of (A) a dimer acid-modified epoxy resin, 200-1,900 parts by mass of (B) a high-melting-point metal powder that contains a silver-coated copper alloy powder and has a melting point of 800°C or more, 400-2,200 parts by mass of (C) a silver-coated copper alloy powder that has a melting point of 800°C or more, 1.0-20.0 parts by mass of (D) a curing agent that contains a hydroxyl group-containing aromatic compound, and 5.0-100.0 parts by mass of (E) a flux that contains a polyvalent carboxylic acid. |