| abstract |
PROBLEM TO BE SOLVED: To provide a chamber liner having plasma resistance. A process for forming a protective layer on an article includes providing an article for an etch reactor (eg, a chamber component) and depositing a first protective layer on at least one surface of the chamber component. Then, a plasma spray deposition process is performed. The first protective layer is a plasma resistant ceramic having a thickness greater than about 50 microns and a plurality of cracks and pores. Then, an ion assisted deposition (IAD) process is performed to deposit the second protective layer on the first protective layer. The second protective layer is a plasma resistant rare earth oxide having a thickness of less than 50 microns and a porosity of less than 1%. The second protective layer seals the plurality of cracks and pores of the first protective layer. [Selection diagram] Fig. 6B |