| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73e224665ceb7b15f8e66dfd0ee245c6 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-0881
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-544
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-54486
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2237
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2275
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-3437
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-3462
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-357
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0041 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-013 |
| filingDate |
2018-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50fac5effd00dfa0f14ec7433da60867
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f542fa6e388aad5e7b8a4b54054515a8 |
| publicationDate |
2020-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2020015873-A |
| titleOfInvention |
Resin composition for semiconductor encapsulation, semiconductor device, and method of manufacturing semiconductor device |
| abstract |
A semiconductor sealing resin capable of maintaining the insulating property of a sealing material and improving concealment of an internal structure of a semiconductor device while suppressing the thickness of the sealing material in a semiconductor device. A composition is provided. A resin composition for semiconductor encapsulation contains a thermosetting resin (A), a filler (B), and a colorant (C). The average particle diameter of the filler (B) is 0.5 μm or more and 15.0 μm or less. The electrical resistivity of the coloring agent (C) is 1.0 Ω · m or more. [Selection diagram] Fig. 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20230115846-A |
| priorityDate |
2018-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |