| abstract |
The present invention provides an epoxy resin composition for semiconductor encapsulation that does not cause electrical defects such as wiring short-circuits and leakage defects, and has excellent laser marking properties. An epoxy resin composition comprising (A) an epoxy resin, (B) a phenol resin-based curing agent, (C) an inorganic filler excluding the following component (E), (D) a curing accelerator, and (E) silicon carbide. An epoxy resin composition for encapsulating a semiconductor, wherein the silicon carbide (E) has an average particle size of 1 nm or more and 1000 nm or less. [Selection figure] None |