| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_420daa3f9261e0daeae632278501ddc3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-04 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09C1-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-04 |
| filingDate |
2006-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_79ec05ba7a5da93a807d1952f010ec6b |
| publicationDate |
2006-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2006095914-A1 |
| titleOfInvention |
Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| abstract |
Disclosed is an epoxy resin composition for semiconductor encapsulation comprising an epoxy resin (A), a phenol resin (B), an inorganic filler (C), a curing accelerator (D) and a surface-treated coloring agent (E) wherein the coloring agent before surface treatment is composed of a carbon precursor having a carbon content of not less than 90% by weight or a carbon black having a DBP absorption of not less than 100 cm3/100g. Also disclosed is a semiconductor device encapsulated by using such an epoxy resin composition. This epoxy resin composition for semiconductor encapsulation exhibits excellent laser marking properties without causing short-circuits of wiring, electrical defects such as leakage defects, or wire deformation. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009035696-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008081590-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020022070-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020015873-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7170240-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021157623-A1 |
| priorityDate |
2005-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |