http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016225524-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19b5c6093f8859d3e6bf9237df2eb5b |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
filingDate | 2015-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c53ccbd3c70225a3324151db2ca2112d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_17cd8b1dbb903ddae3f28ecb13ad0400 |
publicationDate | 2016-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2016225524-A |
titleOfInvention | High frequency printed wiring board substrate, high frequency printed wiring board, high frequency printed wiring board substrate manufacturing method, and high frequency printed wiring board manufacturing method |
abstract | An object of the present invention is to provide a substrate for a high-frequency printed wiring board that can reduce transmission loss and improve high-frequency characteristics by suppressing loss due to the skin effect. A substrate for a high-frequency printed wiring board according to the present invention includes a dielectric layer mainly composed of a fluororesin and modified on one side and a seed laminated on one side of the dielectric layer. The seed layer is mainly composed of metal, and the seed layer has an average thickness of 2 μm or less. The metal may be copper or a copper alloy. The seed layer is preferably composed of a sintered body of metal particles, and the average particle diameter of the metal particles is preferably 1 nm or more and 500 nm or less. The average thickness of the seed layer is preferably 10 nm or more and 1 μm or less. The arithmetic average roughness Ra of the other surface of the seed layer is preferably 2 μm or less. A plating layer may be provided on one surface side of the seed layer. [Selection] Figure 1 |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022201563-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019077816-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11785721-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210022533-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10842027-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3796762-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11752734-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20220118903-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-4048037-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11490528-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111213437-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210033412-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019075456-A |
priorityDate | 2015-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 52.