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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
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filingDate 2015-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c53ccbd3c70225a3324151db2ca2112d
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publicationDate 2016-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2016225524-A
titleOfInvention High frequency printed wiring board substrate, high frequency printed wiring board, high frequency printed wiring board substrate manufacturing method, and high frequency printed wiring board manufacturing method
abstract An object of the present invention is to provide a substrate for a high-frequency printed wiring board that can reduce transmission loss and improve high-frequency characteristics by suppressing loss due to the skin effect. A substrate for a high-frequency printed wiring board according to the present invention includes a dielectric layer mainly composed of a fluororesin and modified on one side and a seed laminated on one side of the dielectric layer. The seed layer is mainly composed of metal, and the seed layer has an average thickness of 2 μm or less. The metal may be copper or a copper alloy. The seed layer is preferably composed of a sintered body of metal particles, and the average particle diameter of the metal particles is preferably 1 nm or more and 500 nm or less. The average thickness of the seed layer is preferably 10 nm or more and 1 μm or less. The arithmetic average roughness Ra of the other surface of the seed layer is preferably 2 μm or less. A plating layer may be provided on one surface side of the seed layer. [Selection] Figure 1
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Total number of triples: 52.