| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c186e9ae8cafab5df5c8d80cfa7b0fa1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_943ce8b5eab241d0469c8cbcbcd3dbce |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| filingDate |
2014-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_56b451c2537e9d9e0ade27d07020cc0d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_19211ea3a10092ba36ad514fe188576a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fbff187602bda4c37263051f1997de85
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ddf5311d4e712e25d090fe67415f6da3 |
| publicationDate |
2015-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2015097257-A |
| titleOfInvention |
Fluororesin substrate, printed wiring board, and circuit module |
| abstract |
An object of the present invention is to provide a fluororesin substrate having a stable surface modification state, a printed wiring board having the fluororesin substrate, and a circuit module. A fluororesin base material according to an embodiment of the present invention is a fluororesin base material mainly composed of a fluororesin, and has a modified layer in at least a part of the surface thereof. The porous layer contains a siloxane bond and a hydrophilic organic functional group, and the contact angle with pure water on the surface of the modified layer is 90 ° or less. The peel strength of the epoxy resin adhesive having an average thickness of 25 μm with respect to the surface of the modified layer measured using a polyimide sheet having an average thickness of 12.5 μm as a flexible adherend is preferably 1.0 N / cm or more. As the average surface roughness of the surface of the modified layer, Ra is preferably 4 μm or less. The printed wiring board which concerns on one Embodiment of this invention has the said fluororesin base material. The circuit module which concerns on one Embodiment of this invention has the said printed wiring board. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110754141-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10912193-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200040810-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019064871-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015122448-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115698151-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11375615-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111699761-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111527799-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016225524-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111527799-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I689230-B |
| priorityDate |
2013-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |