| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-334 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32605
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67248
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02274
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68735
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32541
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32467
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67109
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32642
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02104
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32697
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6833 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05H1-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 |
| filingDate |
2013-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2015-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2015522938-A |
| titleOfInvention |
Method and apparatus for controlling substrate uniformity |
| abstract |
Provided are a dynamically adjustable process kit, a processing chamber having a dynamically adjustable process kit, and a method for processing a substrate using the dynamically adjustable process kit. A dynamically adjustable process kit allows one or both of the electrical and thermal states of the process kit to be changed without changing the physical structure of the process kit, thereby enabling plasma properties without changing the process kit. That is, the processing result can be easily changed. A processing chamber having a dynamically adjustable process kit includes a chamber body including a portion of a conductive sidewall configured to be electrically controlled and a process kit. The processing chamber has a first control system operable to control one or both of electrical and thermal states of the process kit and a second control operable to control an electrical state of a portion of the sidewall. Including the system. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7278896-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017130659-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018190978-A |
| priorityDate |
2012-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |