http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015203066-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1bc9976a81442c6b94ccab8ba654cc28 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 |
| filingDate | 2014-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad22ecf667e0bac9d3df8bb1a0d4d440 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f3c900ab385d021de84cf325d045079c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f19916b24927bd1f77f05aba215eec06 |
| publicationDate | 2015-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2015203066-A |
| titleOfInvention | Resin composition for sealing and semiconductor device using the same |
| abstract | The present invention provides a sealing resin composition having good storage stability and good cured product characteristics and moldability. SOLUTION: (A) Epoxy resin, (B) Phenol resin curing agent, (C) Urea-based curing accelerator and (D) Inorganic filler are essential components, and an elevated flow after storage at 25 ° C. for 1 month A sealing resin composition having a viscosity of 1 to 10 Pa · s and a semiconductor device sealed using the sealing resin composition. [Selection figure] None |
| priorityDate | 2014-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 42.