| abstract |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition particularly excellent in storage stability and a semiconductor encapsulation device sealed using the same. SOLUTION: (A) an epoxy resin, (B) a phenol resin as a curing agent, (C) an inorganic filler, and (D) a urea compound represented by the following formula as a curing accelerator: And a semiconductor sealing device in which a semiconductor chip is sealed with a cured product of the composition. |