| abstract |
To provide a resin package having high dimensional accuracy, low warpage, low thermal expansion, and high heat resistance based on a thermosetting resin. A polyfunctional epoxy resin obtained by glycidylation of a condensate of salicylaldehydes and phenols, (B) a phenol resin curing agent, (C) a curing accelerator, and (D) a weight average. A silica powder having a particle size of 10-30 μm is an essential component, and the (D) silica powder is contained in a proportion of 80-90% by mass in the total resin composition, and the fused silica powder in the (D) silica powder A resin package is formed using a molding resin composition having a ratio of 80 to 100% by mass. [Selection figure] None |