| abstract |
Kind Code: A1 A semiconductor device substrate, particularly a semiconductor device substrate having a metal wiring or barrier metal on its surface, is used in a cleaning process after the CMP process, and has sufficient corrosion resistance to metal wiring and barrier metal and generates residues. And a cleaning liquid and a cleaning method capable of suppressing the adhesion of residues to the substrate surface. A semiconductor device substrate having a pH of 8 or more, comprising (A) a compound represented by general formula (1), (B) an azole compound, (C) a pH adjuster, and (D) four components of water. A substrate cleaning solution for a semiconductor device, wherein the concentration of (B) in the cleaning solution is 0.001 to 2% by mass. [Selection figure] None |