http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014129560-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
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filingDate 2012-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a647f11e9d497d0ae1427cc500770a9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7f421f8bbde1a7daafd1a7ed857dd8d
publicationDate 2014-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2014129560-A
titleOfInvention Surface-treated copper foil and printed wiring board using the surface-treated copper foil
abstract [PROBLEMS] To obtain a normal peeling strength without forming a layer containing a chromium component, and to maintain the peeling strength even after high temperature environment, moisture absorption, or immersion in chemicals. Without providing a surface-treated copper foil having long-term rust prevention. SOLUTION: On one surface of a copper foil 1, a fine particle layer 2 made of copper particles, copper-nickel particles, copper-cobalt particles, copper-nickel-cobalt particles, a layer 3 made of nickel or nickel-phosphorus, and an alkali A layer 4 made of a metal silicate and a silane coupling agent is formed in order, and the particle diameter of the fine particles is 0.3 μm or less, and the surface area of the fine particle layer 2 is the copper before the formation of the fine particle layer. treated copper foil 1, characterized in that 177μm is 2 per 60 [mu] m 2 ~900Myuemu 2 rises from the surface area of the foil 1. [Selection] Figure 1
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