| abstract |
PROBLEM TO BE SOLVED: To reinforce the adhesion of a conductive film such as silver, copper or tin to a specific light metal selected from aluminum, magnesium and titanium which easily forms a nonconductive state. SOLUTION: A method for forming a conductive film such as silver, copper, tin, etc. on a light metal via a base film, wherein the base film is a nickel-phosphorus film, and the base film is a predetermined complexing agent. , Using an electroplating bath containing a surfactant, a brightening agent, and the like, and heat-treating the base film or the base film and the conductive film under conditions including a low temperature range of 30 ° C. or higher. Compared to the method without, it is possible to reinforce the adhesion of the base film to the light metal, and to form the conductive film more firmly on the light metal. [Selection figure] None |