| abstract |
The present invention provides a roughened copper foil that is excellent in fine pattern circuit formability and transmission characteristics in a high frequency region, and has excellent adhesion to a resin base material and chemical resistance. At least one surface of a base material copper foil (untreated copper foil) is subjected to a roughening treatment in which Rz increases by 0.05 to 0.3 μm with respect to the surface roughness Rz of the base material copper foil. And a roughened copper foil having a roughened surface having a surface roughness Rz of 1.1 μm or less after the roughening, wherein the roughened surface has a width of 0.3 to 0.8 μm and a height. 0.4 to 1.8 μm, aspect ratio [height / width] of 1.2 to 3.5, and a roughened surface-treated copper foil formed of convex-shaped roughened particles with sharp tips It is. [Selection figure] None |