| abstract |
An anisotropic conductive paste having sufficient adhesive strength, insulation and moisture resistance even when the temperature during thermocompression bonding is low (for example, 180 ° C. or lower). An anisotropic conductive paste of the present invention comprises (A) a thermoplastic resin, (B) a (meth) acrylate reactive diluent having one unsaturated double bond in one molecule, C) a radical polymerization initiator, (D) an activator having one or more carboxyl groups in one molecule, and (E) solder powder. The (A) thermoplastic resin is a styrene / butadiene copolymer. It is at least one selected from the group consisting of a hydrogenated product of a polymer and a styrene / butadiene copolymer. [Selection figure] None |