| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_07df74462e6193cbf71c250f0d4590e7 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R11-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 |
| filingDate |
2014-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a4104f56087179f47caef889e303858
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_318137245af07a1d625efbca945cd077
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3a2e5d2029d492a023556341c7852eaa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d92ad5d95f09abb7efdd00fa14699d0 |
| publicationDate |
2015-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2015221875-A |
| titleOfInvention |
Adhesive and connection structure |
| abstract |
PROBLEM TO BE SOLVED: To provide an adhesive having excellent adhesion and heat dissipation to an electronic component that dissipates heat and a connection structure using the same. An adhesive contains an epoxy compound, a cation catalyst, and an acrylic resin containing acrylic acid and an acrylic ester having a hydroxyl group. Acrylic acid in the acrylic resin reacts with the epoxy compound to cause a connection between the acrylic resin island 13 and the epoxy compound sea 12, and the surface of the oxide film 11 a is roughened to anchor the epoxy compound with the sea 12. In addition, the solder particles 11 contained therein are melted to form a metal bond with the electrode 10, thereby increasing the adhesive force between the adhesive and the electrode 10 and further improving the heat dissipation characteristics from the metal bond surface. it can. [Selection] Figure 2 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2021168387-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7359804-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015221876-A |
| priorityDate |
2014-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |