| abstract |
Provided are an adhesive agent of superior adhesiveness and heat radiation performance with respect to an oxide film, and a connection structure using same. The adhesive agent contains an epoxy compound, a cationic catalyst, and an acrylic resin comprising acrylic acid and a hydroxyl group-containing acrylic acid ester. The acrylic acid in the acrylic resin reacts with the epoxy compound to produce links between islands (13) of the acrylic resin and a sea (12) of the epoxy compound, and also roughen the surface of an oxide film (11a), thus strengthening an anchoring effect with respect to the sea (12) of the epoxy compound. Melting solder particles (11) contained in the adhesive agent causes a metal bond to be formed with an electrode (10), making it possible to enhance the adhesive strength between the adhesive agent and the electrode (10) and further improve the properties of heat dissipation from the metal bond surface. |