| abstract |
Epoxy resin composition capable of achieving both high thermal conductivity and low melting point, and semi-cured epoxy resin composition, cured epoxy resin composition, resin sheet, prepreg, laminate, metal substrate, and print using the same Provide a wiring board. Two or more epoxy resin monomers having an absolute value of a difference between a temperature at which a crystal phase is changed to a liquid crystal phase and a temperature at which the liquid crystal phase is changed to an isotropic phase are 25 ° C. or more, a curing agent, An epoxy resin composition comprising an inorganic filler. [Selection] Figure 1 |