abstract |
The present invention provides an epoxy resin molding material comprising an epoxy resin, a phenol curing agent, an electrically insulating inorganic filler, and a silane coupling agent, wherein the silane coupling agent contains a phenyl group-containing silane coupling agent, the epoxy resin contains a mesogenic skeleton-containing epoxy resin, and the ratio of the mesogenic skeleton-containing epoxy resin is 50 mass% or more of the total amount of the epoxy resin. The present invention also provides a molded article produced by press-molding the epoxy resin molding material and a molded and cured article obtained by postcuring the molded article by heating. |