abstract |
The epoxy resin composition contains an epoxy resin and a curing agent, and the epoxy resin has at least one selected from the group consisting of structural units represented by the following general formula (IA) and structural units represented by the following general formula (IB). A dimer compound comprising a dimer compound, comprising a dimer compound comprising two structural units represented by the following general formula (II) in one molecule, and occupying all of the epoxy resin, The ratio is 15% by mass to 28% by mass. |