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filingDate 2010-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad53c252b354dac160769252360c757b
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publicationDate 2012-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2012087250-A
titleOfInvention Thermally conductive resin composition, resin sheet, prepreg, metal laminate and printed wiring board
abstract The present invention provides a thermally conductive resin composition capable of improving thermal conductivity so as to effectively dissipate heat from an electronic component to the outside. A heat conductive resin composition comprising two or more inorganic fillers in a total amount of 60 to 95% by mass, at least a first inorganic filler having a Mohs hardness of 4 or more, and a second conductive filler composition. A thermally conductive resin composition, wherein the Mohs hardness of the inorganic filler is 3 or less, and the ratio of the first inorganic filler to the second inorganic filler is 1: 1 to 0.01. [Selection figure] None
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