| abstract |
An object of the present invention is to provide a resin composition, a semiconductor sealing material, a prepreg, and a cured product excellent in thermal conductivity and heat resistance. SOLUTION: General formula (1) [Chemical 1] (In the formula, each R independently represents a hydrogen atom or a methyl group. Each R ′ independently represents a hydrogen atom, a hydrocarbon group having 1 to 8 carbon atoms, a trifluoromethyl group, an aryl group, or a methoxy group. .) An epoxy resin composition comprising an epoxy resin, a curing agent and an inorganic filler having a thermal conductivity of 20 W / m · K or more. [Selection figure] None |