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filingDate 2007-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3f1a26c3e267116c55dfbdf04c606d08
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publicationDate 2009-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2009102577-A
titleOfInvention Thermally conductive composition
abstract The present invention provides a heat conductive composition that can be more suitably used for heat conduction from a heating element. A thermally conductive composition contains an organic matrix and a thermally conductive filler. The organic matrix includes a titanate coupling agent, and the ratio of the titanate coupling agent to the total mass of the organic matrix is 3 to 100% by mass. The thermally conductive filler includes a thermally conductive filler having a particle shape with a particle size of 0.1 to 1 μm, and a thermally conductive filler having a particle shape with a particle size of more than 1 μm and 100 μm or less. I have. The ratio of the thermally conductive filler having a particle shape with a particle size of 0.1 to 1 μm with respect to the total mass of the thermally conductive filler is 1 to 50 mass%. The ratio of the heat conductive filler to the total volume of the heat conductive composition is 80 to 86% by volume. [Selection figure] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019089957-A
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