| abstract |
Provided is a thermosetting resin composition for a circuit board having low water absorption and high insulation reliability while efficiently shielding ultraviolet rays, and a prepreg, laminate and resin sheet using the same. A printed wiring board and a semiconductor device are provided. A thermosetting resin composition according to the present invention comprises (A) a bismaleimide compound, (B) a curable resin, and (C) a curing agent and / or (D) a curing catalyst. A composition comprising a mass of the (A) bismaleimide compound relative to a total mass of the (A) bismaleimide compound, the (B) resin, and the (C) curing agent and / or the (D) curing catalyst. The proportion is characterized by 2 to 12% by mass. [Selection figure] None |