| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3415
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 |
| filingDate |
2015-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d28d87c0673242a67edd03d902bbdc65
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_90c76436c5c490b3dd44b78df39998a7 |
| publicationDate |
2017-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2017071738-A |
| titleOfInvention |
Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board |
| abstract |
An object of the present invention is to provide a resin composition capable of realizing a printed wiring board excellent in heat resistance, peel strength and thermal expansion coefficient. A resin composition containing a cyanate ester compound (A) and a bismaleimide compound (B) represented by the following formula (1). [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7011589-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018043380-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210093904-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114163596-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2018043380-A1 |
| priorityDate |
2015-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |