abstract |
(57) [Summary] [Structure] (A) Epoxy resin having at least two epoxy groups in one molecule (B) Maleimide compound (C) Curing agent for epoxy resin (D) Basic catalyst The epoxy resin composition, and the composition, Thickness range of 0.1 to 500 μm, curing temperature of 100 to 25 A method for curing an epoxy resin composition, which comprises curing in the range of 0 ° C. [Effect] An epoxy resin composition and a resin composition suitable for use as a powder insulating paint and a liquid insulating material, which can give a cured product having excellent curability in a thin film and excellent heat resistance, The curing method used is provided. |