| abstract |
When electrodes formed on different substrates are joined to each other, even if misalignment occurs, an increase in electrode resistance, current leakage, and the like are prevented without increasing the interlayer capacitance. A first substrate in which a first metal electrode is embedded in a first groove formed in a first interlayer insulating film on a first substrate, and a second interlayer insulating on a second substrate. A second substrate in which a second metal electrode is embedded in a second groove formed in the film is prepared, and the first diffusion prevention layer 16 and the second interlayer insulation film are formed on the first interlayer insulating film 12 and the second interlayer insulating film, respectively. When the first diffusion electrode layer and the first metal electrode 15 and the second metal electrode are joined to face each other, the first diffusion electrode layer in the formation region of each of the first metal electrode 15 and the second metal electrode is formed. A process of forming the first opening 17 and the second opening in each of the first diffusion prevention layer 16 and the second diffusion prevention layer and a heat treatment are performed with the first opening 17 and the second opening facing each other. The first metal electrode 15 and the second metal electrode are joined by thermal expansion. [Selection] Figure 1 |