| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B6-122
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
| filingDate |
2009-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e84e1e32480ebbc3fa771ca8105d6b23
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9844608125bdf65b9c1d103c931feaa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_78663d996f61ad5dfecd2e9821f6e9aa |
| publicationDate |
2011-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2011029410-A |
| titleOfInvention |
Wiring board manufacturing method |
| abstract |
Provided is a method for manufacturing a wiring board that can be processed while maintaining dimensional stability until wiring formation on a back-to-back separation surface and that can ensure high work efficiency. The present invention provides a step A in which two substrates are back to back to form a single substrate, a step B in which wiring is formed on both surfaces of the single substrate, and two supports on the wiring surface. A method of manufacturing a wiring board, comprising: a step C for laminating, and a step D for separating two substrates while being fixed to the support. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2014119178-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11040517-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013031844-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2013031844-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018088493-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190082205-A |
| priorityDate |
2009-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |