http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007188986-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
filingDate 2006-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d00e7f46532865bea583ce840f9e195
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publicationDate 2007-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007188986-A
titleOfInvention Multilayer circuit board and manufacturing method thereof
abstract To reduce the thickness of a multilayer circuit board while ensuring product reliability. SOLUTION: Core layers 101 and 102 obtained by impregnating a core with resin, resin layers 111 and 112 provided between the core layer 101 and the core layer 102, and embedded in the resin layers 111 and 112 And a wiring pattern 140. The thicknesses of the core layers 101 and 102 are both set to 100 μm or less, which makes it possible to sufficiently reduce the thickness of the entire substrate. In addition, since the low-strength resin layers 111 and 112 are sandwiched between the hard core layers 101 and 102, the strength of the entire substrate is greatly improved. [Selection] Figure 1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2013145043-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009119877-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012015334-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011029410-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016510176-A
priorityDate 2006-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003206451-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002185139-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005050997-A
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Total number of triples: 28.