| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2463-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0271
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2379-08 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3114
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-036
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0298 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate |
2017-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_26a57340b063580a7c7e77f79e96dc25
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fdf557d523172a0a0010fb8c83a865c9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_477e9d823e937e4921f27abd249badc9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ebee93f7fa02f183efb35b4c6282f59
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2e72cfd3d11ff400cad932376c8b8c19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bf7b4804230c414b0f50210790b0dddd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b30ab15d873511c8f488996d326f404e |
| publicationDate |
2018-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2018088493-A1 |
| titleOfInvention |
Printed wiring board and semiconductor package |
| abstract |
Provided are: a printed wiring board which is effectively suppressed in warping even through circuit patterns having different metal contents are formed on both surfaces of a cured product sheet of a prepreg; and a semiconductor package which is obtained by mounting a semiconductor element on this printed wiring board. Specifically, this printed wiring board comprises a cured product of a prepreg that contains a fiber substrate and a resin composition, while having circuit patterns which have different metal contents formed on both surfaces of the cured product sheet of the prepreg. This printed wiring board is configured such that: the prepreg has layers, which are formed from resin compositions having different thermal curing shrinkage ratios, on front and back surfaces of the fiber substrate, respectively; and a layer that is formed from a resin composition having a lower thermal curing shrinkage ratio among the above-described layers is present on a surface on which a circuit pattern having a smaller metal content is formed. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3900921-A4 |
| priorityDate |
2016-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |