| abstract |
An object of the present invention is to provide a method for producing a resin structure having high flatness when a fine resin structure is formed on a step portion of a substrate having a step on the surface. A solid photocurable resin composition obtained by blending a solid epoxy resin, a liquid epoxy resin, and a photopolymerization initiator and melted and softened by heating is used, and (a) a substrate having a step on the surface is covered. A step of forming an uncured resin layer comprising a solid photocurable resin composition, (b) in a state where the uncured resin layer is heated to a temperature at which the uncured resin layer is melted or softened, and a flat plate is pressed and contacted with the surface, A flattening step of forming a primary molded body having a flat surface by cooling to a temperature at which the cured resin layer re-solidifies and removing the flat plate, (c) from the upper surface side of the primary molded body, using a mask A step of curing only a predetermined region by selective exposure, and a step of (d) forming a resin structure by developing and removing an unexposed portion of the selectively cured primary molded body. [Selection] Figure 2 |