http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2020203648-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-20 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075 |
| filingDate | 2020-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2020203648-A1 |
| titleOfInvention | Photosensitive resin composition for flattening film formation, manufacturing method of electronic device and electronic device |
| abstract | A photosensitive resin composition for forming a flattening film, which comprises an epoxy resin, a phenoxy resin, and a photosensitizer, and the amount of the phenoxy resin is 20 to 60 parts by mass with respect to 100 parts by mass of the epoxy resin. This photosensitive resin composition preferably contains a surfactant, an adhesion aid and the like. The viscosity of this photosensitive resin composition at 25 ° C. is preferably 1 to 50,000 mPa · s. The weight average molecular weight of the phenoxy resin is preferably 10,000 to 100,000. The epoxy resin preferably contains a polyfunctional epoxy resin having three or more epoxy groups in the molecule. |
| priorityDate | 2019-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 104.