http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020203648-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-20 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20 |
| filingDate | 2020-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_498e21ca4badd42536abec029234792e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dedae417395e5a42164e129307db906e |
| publicationDate | 2020-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2020203648-A1 |
| titleOfInvention | Photosensitive resin composition for planarization film formation, method for producing electronic device, and electronic device |
| abstract | A photosensitive resin composition for planarization film formation, which contains an epoxy resin, a phenoxy resin and a sensitizing agent, wherein the amount of phenoxy resin relative to 100 parts by mass of the epoxy resin is 20-60 parts by mass. This photosensitive resin composition preferably contains a surfactant, an adhesion assistant and the like. It is preferable that this photosensitive resin composition has a viscosity of 1-50,000 mPa∙s at 25°C. It is preferable that the phenoxy resin has a weight average molecular weight of from 10,000 to 100,000. It is preferable that the epoxy resin contains a polyfunctional epoxy resin that contains three of more epoxy groups in each molecule. |
| priorityDate | 2019-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 105.